Semiconductor Equipment Corporation (SEC)
3150 Wafer/Film Frame Tape Applicator
Semiconductor Equipment Corporation (SEC) Model 3150 Wafer/Film Frame
Tape Applicator is capable of handling wafers up to 8" in diameter. System
applies tape with optimal control of temperature and pressure parameters
resulting in uniform, bubble-free mounting of tape for wafer dicing.
State-of-the-art features make this model one of the most advanced and
versatile systems available.
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